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Nikkei MICRODEVICES

June 2005

Cover Story

Korean LCD strategy - top place also in television; their strength coming from "manufacturing power"


Special Feature

What financial reports can tell you about semiconductors and displays


LSI

Inside
Using SystemC for SoC performance verification; reduces TAT by 30%

Report
Matrix to release 3D memory on a gigabit scale

Report
High-speed circuit structure verification with 200 million-pixel high resolution SEM

Report
A number of element processes proposed to break the barrier of 45nm wiring

Report
Shorter wavelength solves the challenges of thin film measurement for 65nm and beyond

FPD

Inside
Breakthrough in SED technology - the manufacturing method as well as the structure of electron emitters unveiled

Report
New photomask plant with an eye on the 8th generation starts operation; supports four-mask process

Report
A new transfer technology for the 8th generation manufacturing process transfers glass substrates in a laid down position


New Technology

Report
MEMS device that replaces quartz oscillator to be developed into a product


Tutorial

System-level design gathers attention in multiprocessor core design


Emerging Technology

Dry ice sprayed to remove foreign materials on mask


Keyword

Intellectual Property High Court


Key Person

Freescale of the U.S. wins a growing market with its product lineup


Interview

Challenging Applied Materials with the speed in implementing new technology


Challenger

Developing a processor with 3D transistor - competing against Intel, fully aware of the risks


 

Nikkei MICRODEVICES

June 2005

Cover Story

Korean LCD strategy - top place also in television; their strength coming from "manufacturing power"


Special Feature

What financial reports can tell you about semiconductors and displays


LSI

Inside
Using SystemC for SoC performance verification; reduces TAT by 30%

Report
Matrix to release 3D memory on a gigabit scale

Report
High-speed circuit structure verification with 200 million-pixel high resolution SEM

Report
A number of element processes proposed to break the barrier of 45nm wiring

Report
Shorter wavelength solves the challenges of thin film measurement for 65nm and beyond

FPD

Inside
Breakthrough in SED technology - the manufacturing method as well as the structure of electron emitters unveiled

Report
New photomask plant with an eye on the 8th generation starts operation; supports four-mask process

Report
A new transfer technology for the 8th generation manufacturing process transfers glass substrates in a laid down position


New Technology

Report
MEMS device that replaces quartz oscillator to be developed into a product


Tutorial

System-level design gathers attention in multiprocessor core design


Emerging Technology

Dry ice sprayed to remove foreign materials on mask


Keyword

Intellectual Property High Court


Key Person

Freescale of the U.S. wins a growing market with its product lineup


Interview

Challenging Applied Materials with the speed in implementing new technology


Challenger

Developing a processor with 3D transistor - competing against Intel, fully aware of the risks