Keyword  ... p. 10

IEEE Project 802

What’s New   ... p. 26

A “Red” Next-Generation DVD Standard Begins to Capture BRICs

The Reason Hoya Merges Pentax

Nichia Develops White LED with Luminous Efficiency of 150lm/W

Fuji Heavy Industries Realizes High Capacity Second Li-ion Battery with a New Anode

An Interview with IEEE802 Chairman

Leading Trends

ISSCC 2007 Preview   ... p. 43

ISSCC (International Solid-State Circuits Conference) 2007 is scheduled for February.  We summarize the expected highlights of the conference based primarily on comments from the ISSCC Far East Regional Committee.  A number of analog integrated circuits run on 1V or less are due to be featured.

IEEE802 Project is on The Verge of a Collapse   ... p. 55

The IEEE 802 LAN/MAN Standards Committee, home base for standardization of cabled and wireless LAN, is beginning to waver.  Intense conflict among manufacturers has led to the collapse of certain subcommittees and a cessation of activities by others.  Future standardization activities to be undertaken by the IEEE (Institute of Electrical and Electronics Engineers) are likely to be affected.

Cover Story

3D Structure Helps Moore’s Law   ... p. 73

Enormous changes are about to happen that are going to influence the future of LSI.  Three-dimensional LSI is set to become a key technology in bringing about high LSI performance and low costs.  Such a development has the potential to realign powers of influence within the semiconductor industry and break down the conventions of electronics design.

A Paradigm Shift   ... p. 74

The stirrings of major reform—“horizontal to vertical” shift is revolutionizing LSI

The Road to Implementation   ... p. 82

Development is aimed at switching from memory to logic LSI around 2010

What the Developers Are Saying   p. 89

Earlier development of 45nm processes is bearing fruit as companies bounce ideas off one another

Next-Generation Technology in Detail   ... p. 91

Establish 45nm logic LSI technology—shorten delay by more than 30%

Interview

UIEvolution’s Chief Executive Officer Satoshi Nakashima

“A Master of Software Has a Dream for an Evolution of Hardware”

   ... p. 97

Tech Tale

How to Make a Small Robot for Exploring Asteroids (Part 2): Blaze, Extreme Cold and Cosmic Rays   ... p. 100

Embedded Systems Academy

Tutorial of the Embedded System (Part 1): A Compiler Doesn't Work With a Microcomputer     ...  p. 105

NETs Seminar

How to Manage Chinese EMS (1st Half)   ... p. 112

What is the best way to make use of electronic manufacturing services (EMS), contracted to carry out design and manufacturing of electronic devices?  This is currently a major question being asked by Japanese electronics manufacturers.  In this series, we introduce the essentials based on the experience and ideas of Junichi Fujioka from KFE Japan Co., Ltd., which began utilizing EMS with almost no assistance.  Fujioka has been engaged in product development, procurement and quality assurance for cameras, audio equipment and other devices in the Taiwan-Hong Kong-China area since 2001.

An Survey Report of Actual Conditions and Skills of Embedded Engineers   ... p. 120

Cost estimates for projects are impossible; there are not enough competent engineers and no systematic educational or training methods in place, or any way to evaluate them; most engineers look for opportunities in management—a survey of approximately 2,800 embedded software engineers regarding conditions and skills has uncovered a host of issues faced at the frontline of embedded software development.