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Copyright(c)2007 Nikkei Business Publications, Inc. All Rights Reserved. All editorial content and graphics on this Web site may not be reproduced in whole or in part without the express permission of the copyright owner. |
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Nikkei MICRODEVICES |
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June 2007Feature Low power consumption design is the standard for all LSI Special Feature Value Assessment of Japanese LSI manufacturers (1) Inside LSI Healthcare industry gets the ball of standardization rolling Inside LSI "300mm Prime" improves the productivity Inside LSI DENSO reveals their in-vehicle MEMS technology Report LSI Toshiba develops the 1 nm-class accuracy carrier distribution detection technology Report LSI Pricing optimization reduces LSI manufacturers' costs Report LSI The latest platform from Tessera Tec Report LSI IBM introduces the self-assembly airgap technology to LSIs Report LSI Si hole-through electrode technology is now in the pre-production stage to study the cost-reduction measures Succeeding arrival of new cost reduction measures for mask lithography Inside FPD Appearance of a new membrane display with the higher light usage efficiency Report FPD FPD market prospects in the second half of 2007 Tutorial LSI Comprehensive guide to LSI testers that break the 45 nm mark (2) Emerging Tec IBM develops the device analysis method using MRI Key Word Green laser Key Person Samsung Electronics' LCD business strategy Interview ULVAC's business strategy to win over C Micro Precision aims at the first in the ultra-compact projector market |
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