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December 3, 2007News p. 7 The ITU-R Decides on Spectrum to Be Used for 4G Mobile Phones Why Canon Made Tokki into a Subsidiary A Material Is Created that Absorbs Large Quantities of Hydrogen at Room Temperature JAIST Develops a Plant Based Plastic with Heat Resistance of Over 300℃ The Prospect Appears of Controlling Heat in 8 Layer High-speed DRAM NE Interview Microchip Technology Inc., President and CEO,Steve Sanghi: The Small Giant that Stood at the Top of 8 Bit Microcontrollers p. 38 Motorola, Inc. (or the present Freescale Semiconductor, Inc.) fronted the 8-bit microcomputer market for quite some time. Emerging on top in 2006, in a market grappled over by giant semiconductor manufacturers, was U.S.-based, Microchip Technology Inc., known for its PIC microcontrollers. This year, the company has been mounting an attack on the 16-bit market. What is the secret behind the success of this company, which has dared to turn its back on more advanced technologies in order to stubbornly carve a piece out of this market? We talked to President & CEO Steve Sanghi, who has headed the company since its establishment in 1989, about strategy and future projections. Key Person Keyword Ruby p. 45 Cover Story There Is a Blind Spot in Shutting Down Analog TV Broadcasts p. 47 Digital terrestrial broadcasting must be fully prevalent by 2011—this target is unalterable as analog broadcasts are due to end that same year. However, several previously unseen challenges stand in the way of a smooth transition to digital broadcasting and are not limited to transmission concerns such as how to expand the broadcast area. A lack of low-priced products, antenna-related issues, problems concerning facilities with shared reception, and problems with interference form the first set of hitherto unforeseen reception-related issues that are likely to endanger the scheduled termination of analog broadcasts. Prologue p. 48 After the end to analog broadcasts in 2011, who will rule the digital TV bands? The Current Situation p. 50 Scenarios for the transition are starting to come apart at the seams but the end of analog is on schedule The Future p. 59 New interfaces will be required to serve a multitude of channels Special Feature Module Packaging Will Change through Semiconductor Processing Technology p. 85 Production of module substrates is increasing in terms of both volume (measured in area) and monetary value. The value of module substrate production grew 26% year-on-year compared to 15% for electronic circuit boards overall. Higher LSI speeds and improved density of components are placing tougher requirements on module substrates. Rigid module substrates made from resin, in particular, have reached their wiring density limits and costs are climbing. The upshot has been a move by manufacturers to release new module packaging technology using silicon interposers and wafer-level chip-scale packaging (WLCSP). A Myriad of Li-ion Secondary Batteries with Increased Safety Appears p. 93 Since 2006 there has been a series of accidents and problems relating to lithium ion rechargeable batteries. Meanwhile, the hybrid vehicle and electric car markets are really starting to heat up. Attention from various quarters is focusing increasingly on the battery—a Component Sales Website: Product Classes Can Be Selected in 10,000 Piece Lots p. 99 Websites trading in parts come in handy when you are required to complete a prototype by the end of the week in order to meet a deadline. You can have the components you need at your doorstep the next day if you can find them among the tens of thousands of stocked parts. In this article, we outline features, and important points to consider, for each of a number of websites with search functions from which you can purchase components, including semiconductors and connectors, to be used in prototypes of electronic equipment. Guest Paper Negative Effects Hidden in the Development of Semiconductors for Automobiles p. 105 Use of semiconductors in cars is rapidly increasing. Automotive semiconductors were conceived through the integration of two completely different fields—the automotive and semiconductor industries—which has resulted in numerous problems for the developers. This article sheds light on the differences in industry culture by introducing initiatives of the two industries pertaining to automotive semiconductors and through an interview with engineers actually involved in their development. Wireless Technology Developed to Transmit Power Lights Up a 60W Bulb in Tests p. 117 In November 2006, a group of researchers at Massachusetts Institute of Technology (MIT) proposed a new technology called WiTricity (for “wireless electricity”) that would allow several kilowatts of electric power to be transmitted to a device several meters away. They demonstrated the technology in an experiment in June 2007. Mobile phones and other mobile terminals are becoming increasingly popular, but battery capacity has so far been insufficient. Supplying power to these terminals wirelessly would lessen the hassle of recharging and perhaps even allow for batteries of lower capacity. Application of the technology to electric cars is also a possibility. Application of MIT’s technology as an elemental technology is expected to be widespread if not just because it is simple and ordinary. Documentary A Patent Academy 2 Part 2: Creating a Requirement Definition (First Part) p.133 Tutorial Introduction to The final installment explains how all the various technologies are brought together as part of overall design as well as the modeling methods central to achieving this. How to Create a Strong Patent (Part 2): Visualize Technological Issues and Determine Solutions p. 173 The second installment in this series outlines specific procedures for acquiring “strong” patents. Most important is that applications are filed after technical issues have been identified and resolutions found, based on ideas put forward by engineers. We also introduce some of the issues and effective ways to come up with resolutions. World Report From
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