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Copyright(c)2007 Nikkei Business Publications, Inc. All Rights Reserved. All editorial content and graphics on this Web site may not be reproduced in whole or in part without the express permission of the copyright owner. |
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Nikkei MICRODEVICES |
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February 2008Cover Story A new material boosts power semiconductors Special Feature Competition accelerated by industry reorganization and investments in unison. Lowering the power consumption is the key to win. Inside LSI Hardwired OS achieves significantly low power consumption Inside LSI Tightening development race for a new model RAM that succeeds a DRAM Inside FPD Chinese market starts taking the lead in the FPD TV market Inside EDA Renesas Technology employs SSTA （statistical static timing analysis） to design LSI layout Inside Energy Analyst report on the solar cell industry Report LSI Report LSI Report FPD The 2008 International CES report Report MEMS Ideas for RF-MEMS device in succession Challenger Challenging to realize a 3D LSI Emerging Technology Elastic Si wire covers the larger area Tutorial FPD “Positive cycle”of technology development and commercialization brought LCD up to market giant (11) Monthly Keyword Wafer-thin solar cells Key Person Why Honda created a 3D LSI trial model? Key Person LCD business strategy by Taiwanese AU Optronics Interview Pulling down Cree’s fort in the SiC board market |
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