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Copyright(c)2007 Nikkei Business Publications, Inc. All Rights Reserved. All editorial content and graphics on this Web site may not be reproduced in whole or in part without the express permission of the copyright owner. |
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Nikkei MICRODEVICES |
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March 2008Cover Story Strategy and technological expertise to survive the battle field of MEMS device competition Special Feature Power of electronic device production in Inside FPD Inside LSI III – V semiconductors and germanium come in spotlight as the saviors to overcome the limitation of strained silicon technology Inside EDA Panasonic Electronic Devices performed signal integrity simulation across three circuit boards Report LSI Samsung and Hynix collaborate on advanced memory technology development Report LSI Fujitsu's semiconductor business departments will spin off as a subsidiary Report MEMS Report LSI High index immersion lithography falls into dire straits Report FPD Report FPD Report FPD Quality map of FPD TVs is being clarified – Rear projection and plasma face a fork in the road Challenger Emerging Technology Capacitor formation technology that eliminates DRAM downscaling limitation Monthly Keyword Next generation transistor model, HiSIM
Samsung talks their technology development strategy Interview Surpass rivals with robust technological prowess |
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