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Nikkei Electronics

March 13 2006 Issue

Keyword .  .  .  p. 10

organic transistor

What’s New .  .  .  p. 34

• Matsushita Electric Tries to Catch Up with Competitors with a Leica-like Digital SLR Camera
• Chinese TV Manufacturers Enter the Flat-panel TV Market in Earnest
• Security Systems Draw Attention at the Geneva Motor Show
• MITSUMI ELECTRIC Announces a Power Supply Module Aimed at Reducing Standby Power
• Analysis Technology to Catch on Spoken Words Is Applied to Popularity Search of Blogs
• QUALCOMM Bares Fangs at Broadcasting
• A New Green Procurement Survey Starts
• Shinshu University Develops the World’s Brightest Organic EL Technology for Use in Optical Data Communications
  
  

Leading Trends

Ensnaring both Mobile Phones and Automobiles, “Mobile WiMAX” Takes Off.  .  .  p. 61
Mobile WiMAX is attracting attention as a fast and inexpensive data communication service for cars and mobile phones.  Besides the downloading of large-volume audio and video content, the technology will be employable, for example, in road information update services for vehicles.

As the GPL Changes after 15 Years, Linux’s Future Is Shaken.  .  .  p. 75
The General Public License (GPL) that has been crucial to the spread of open source software is being revised for the first time in 15 years.  Newly-included provisions clarifying opposition to digital rights management (DRM) and software patents are having repercussions within the IT industry.

Cover Story

Solar Cells Will Cover the Earth.  .  .  p. 103
Solar cells are selling like hotcakes, particularly in Europe.  Solar cell manufacturers are moving to boost production capacity, while producers belonging to other industries, including automotive and oil industries, are waiting for an opportunity to step into the market.  Costs are falling and applications are expanding thanks to individual nations’ backing of popularization and intensifying competition in development.  
Before long, solar cells will be seen all over the world.


(Part 1) Future Areas of Competition.  .  .  p. 104
Eyeing alternatives to fossil fuels State policy and intense competition will become the main driving force

(Part 2) Spin-off Effects.  .  .  p. 111
Cutting costs and expanding application through semiconductor and panel technologies

(Part 3) A Generational Shift?.  .  .  p. 118
Spherical silicon and non-silicon materials enter the fray: showdown in 2007

Interview

Sony’s EVP Keiji Kimura: “Moving to the Next Phase of the Internet Revolution, Value Is Created through Gaining Insight to the Changes”.  .  .  p. 129

Tech Tale

The Trajectory of Hand Motion Compensation Technology (Part 3): Three People Brought Together Saw the Light.  .  .  p. 132

Guest Paper

Developing Interchip Wireless Communication Technology Able to Transmit at a Speed of 1 Terabit Per Second.  .  .  p. 137
Interchip data transfer rates have finally reached 1 Tbit/s.  While greater speeds are no longer expected from parallel interface, serial interface and other existing wire communications technologies, those speeds are now possible through a state-of-the-art method involving wireless communication between chips. 
1,024 coils are formed on a chip and data is transmitted via magnetic coupling that occurs between upper and lower coils.  This allows communication between three or more stacked chips.  Employing this technology in communication between microprocessor and large-capacity memory enables dramatic improvements in device performance.  
It is also effective in reducing both power consumption and circuit area and therefore will likely be incorporated into portable and digital consumer devices.  “Our current target is 1 Pbit/s”—the developer of this technology explains the current status of research and development and the outlook for future technology.

NETs Buyers’ Guide

Electrically Conductive Bonding Material for Packaging Surfaces.  .  .  p. 150
Seconds are ticking down to implementation of the RoHS Directive on July 1, 2006.  With lead being subject to the restrictions being placed on hazardous substances, attention is returning to the old but novel technology of conductive adhesives.
With their high heat resistance and enabling of low-temperature packaging, conductive adhesives are being viewed as a promising and realistic method for resolving the packaging issues that have arisen from the transition to lead-free electronics.  
We summarize the situation surrounding conductive adhesives currently available, which are alternatives to the solder used in component packaging.

NETs Seminar

Validation Method for Embedded Software (Part 6).  .  .  p. 155
This installment explains the simulation technology that enables the behavior of hardware and real-time operating systems of target embedded devices to be accurately recreated within ordinary host device software development environments such as Visual Studio.

The Expectations for Electronic Paper (Part 1): Hitachi Finds Its Way into Advertising.  .  .  p. 162
In Spring 2006, Hitachi, Ltd. is going to lead the industry with its release of a general-purpose display employing electronic paper.  The company created a stir in December 2005 by testing the display at the JR Tokyo Station.  
This article discusses Hitachi’s approach to the e-paper market with reference to findings from the verification test.

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Keyword:	10
News Ranking	12
What's New:	34
Selected Shorts:	47
Leading Trends:	61
Cover Story:	103
Interview:	129
Tech Tale:	132
Guest Paper:	137
NETs:	150
Calendar:	198
From the Readers:	202
From the Editors:	203