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Electronics March 27 2006 Issue
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Nikkei Electronics |
March 27 2006
Issue
Keyword . . . p. 10
PSE Law
What’s New . . . p. 30
- The PS3’s Launch Is Delayed until November
- The Launch of SED TV Is Delayed
- Jupiter Telecommunications to Provide an HDD Equipped STB for 840 Yen per
Month
- PMA Camera Trade Show: Many Ultra Sensitive and Other Devices Appear
- Intel Reveals Details of Its Next Generation Microprocessor Architecture
- Renesas Technology Proposes a New Architecture to Speed up Internal and External
Communications within SiPs
- Sumita Optical Glass Develops a Combined LSI Laser
and Optical Fiber for a White Light Source
Leading Trends
Digital Controls Will Completely Change Power
Sources[Supply]. . . p.
55
Digitally-controlled power supply circuits equipped with functions for detailed
setting of output characteristics according to the software are starting to attract
a lot of attention. There is a possibility the role of power supply circuits
within electronic devices will change considerably.
CeBIT 2006 Detailed Report: Korea, Taiwan and China Show Their
Momentum in Mobile Phones and Personal Computers. . . p.
67
Exhibitors from Taiwan, China and South Korea were a major presence at CeBIT
2006, the world’s largest electronics and information technology fair held
in March in Hanover, Germany.
They displayed a string of new products related
to mobile phones and personal computers. You barely noticed Japanese manufacturers
were there.
Cover Story
The Scenario for the Evolution of Digital
Home Electronics as Drawn by Telecommunications Carriers. . . p.
85
Nippon Telegraph and Telephone Corporation (NTT) and other fixed-line telecommunications
operators (“carriers”) around the world are pursuing the construction
of next-generation IP networks.
Carriers can use these next-generation
networks (NGNs) to ascertain data on users, or terminals, and service data in
order to provide the most suitable communications services. Connection
with terminals will be essential if this concept is to take off. Carriers
have their minds on vertical integration as they focus on the development of
digital home electronics.
(Part 1) General Overview. . . p. 86
NTT wants to be like NTT DoCoMo—targeting connection between fixed lines
and Internet-connected home electronics
(Part 2) Terminals. . . p. 94
SIP terminals in mobile terminals to home electronics
(Part 3) Communications Infrastructure. . . p. 100
Open source, low-price, high quality communications equipment
Interview
Eastman Kodak’s Vice President and Kodak Japan’s President
Yusuke Kojima: “‘Japan + Something’ Is the Key to Winning in
the Worldwide Market”. . . p.
105
Tech Tale
The Trajectory of Hand Motion Compensation Technology (Part 4): “From
the Middle of ‘Destruction and Creation’” . . p.
108
Guest Paper
Plating Technology to Reduce Whiskers; Avoid Short Circuits from
Narrow Pitch Connectors. . . p.
113
Many device manufacturers agonize over the hair-like metallic crystals
called “whiskers” that appear on connectors and flexible circuit
boards. Longer whiskers grow to a length of well over 100µm. These
whiskers cause short circuits between terminals leading to signal failure. Failures
caused by whiskers have recently surfaced with the advanced use of lead-free
plating, a response to the RoHS Directive to be enforced in Europe from June
2006.
With implementation of the RoHS Directive just around the corner,
most manufacturers are accepting the extra costs involved in switching to gold
plating, through which whiskers are not formed. Panasonic Shikoku Electronics
Co., Ltd., however, joined up with Ormecon Chemie GmbH & Co. KG of Germany
to develop a plating technique to control whisker formation without having to
use gold. Panasonic Shikoku Electronics explains to us the features and
effects of their technique.
NETs Buyers’ Guide
Lead Free Solder. . . p.
120
The electronics industry has worked as a whole for the last 10 years or so to
eliminate the use of lead in solders, and those efforts are drawing close to
completion with the June 2006 implementation of European restrictions on hazardous
substances, the RoHS Directive, just around the corner. Demand for lead-free
solders is diversifying, which is why solder manufacturers offer device manufacturers
solders to match their needs.
In clarifying the features of the different
types of lead-free solders, this article introduces the mainstream Sn-3Ag-0.5Cu
product lineup. Manufacturers are competing with each other in the supply
of solders that support high-temperature preheating and high-speed printing processes.
NETs Seminar
Validation Method for Embedded Software (Final). . . p.
126
The final installment in this series describes software configuration management
tools. Currently only a minority of organizations carry out configuration
management systematically during embedded software development. We provide
a simple comparison of the different configuration management tools.
The Expectations for Electronic Paper (Part 2): A Myriad of Electronic Book
Readers Appear around the World. . . p.
131
United States company, E Ink Corporation, put its “electrophoretic” electronic
paper to practical use ahead of the competition. Reading devices employing
the company’s electronic paper are already on sale and the number of such
products is expected to rise further in 2006.
In this installment, we receive
an explanation of how e-paper is applied in reading devices, which are a major
application of the technology, and we hear about E Ink’s product development
direction.
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| Keyword: |
10 |
| News Ranking |
12 |
| What's New: |
30 |
| Selected Shorts: |
47 |
| Leading Trends: |
55 |
| Cover Story: |
85 |
| Interview: |
105 |
| Tech Tale: |
108 |
| Guest Paper: |
113 |
| NETs: |
120 |
| Calendar: |
152 |
| From the Readers: |
156 |
| From the Editors: |
157 |
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