Home :. Table of Contents :. Index :. Nikkei Electronics May 09 2005 Issue

Nikkei Electronics

May 09 2005 Issue

Spotlight . . . p. 22

Canon and Toshiba Show Confidence They Can Start Mass Production of SED in August

What’s New. . . p. 27

• Toshiba and IBM Signal that the Development of Cell Is Progressing Towards Inclusion in CE Devices
• Why Fujitsu Could Take the Lead in Creating a PC Able to Record/Play Back HDTV?
• Power and Heat Control Components Pushing Reduction in Size of PCs and Mobile Phones
• H.264 Compression Technology Continues to Progress with Compression of 1080p Video Stream at 1.8 Mbps
  
  

Leading Trends

Perpendicular Recording Shows a Path to a HDD with 500Gbit/inch² by 2010
. . . p. 49
The future of hard disk drives (HDD) is looking bright. At last, after uncertainty for some time, the development of HDD technology is coming into focus. In the years ahead, we can expect to see a roughly 30% annual increase in surface recording density.

Negotiations to Unite Next Generation Optical Media Specifications Raises Patent Concerns . . . p. 59
Will a compromise be reached between the Blu-ray Disc and HD DVD camps? Negotiations aimed at integrating the two standards have begun, bringing to the surface a new challenge. We explore the issue of patent licensing, over which debate behind closed doors has commenced.

Cover Story

White Box CE Products Aren’t Yet Past Their Prime . . . p. 75

(Part 1)
Large home appliances, such as refrigerators and washing machines, have long been identified as “mature products.” Both of these products enjoy a diffusion rate close to 100 percent.
Even so, sales are growing and we are constantly seeing new models equipped with the latest features. Manufacturers, who believe thee market for large home appliances is far from reaching maturity, are busy developing products that incorporate various devices to stimulate consumer appetite, exposing hidden needs that consumers themselves are unaware of.
A sense of crisis toward the state of manufacturing within Japan is also holding considerable sway.

(Part 2)
Examples

Guest Viewpoint

Latest Heat Dissipation Technologies Use Cutting Edge Components to Expel Heat . . p. 95
Heat dissipation in semiconductors and printed circuit boards is becoming a serious issue. This is due to an increasing amount of heat released by semiconductor components caused by further miniaturization and faster operating frequencies. Microprocessors such as Intel Corporation’s Pentium 4, which operates on a 3.6GHz frequency, are coming out with maximum electric power consumption over 100W.
Meanwhile, high-density mounting technology and the miniaturization of devices are progressing. For instance, mobile phone manufacturers are competing over every 0.1mm in size reduction. Current cooling fans will not be as effective when there is less space for air to pass through the chassis.
Also, more power semiconductors are used for applications that have to deal with large amounts of power. Power semiconductor efficiency is approaching its limits and therefore more heat is going to be released. It is only recently that a number of new options for heat dissipation technologies have emerged. The features of the various technologies are introduced.

NET's Seminar

The History of Benchmark Testing (Part 4): Reconfigurable Processors Start Call for New Rating Standard . . . p. 102
Twenty years of progress in benchmark testing led to the establishment of the convenient EEMBC benchmarks. New cores with flexible architecture and the focus of device designers on low power consumption are likely to spawn even more advances in benchmark testing.

How to Control Leak Current (Part 8): Reducing Electrical Power Leaks Occurring in Memory and Analog Circuits . . . p. 112
Following on from the previous installment, we explain the applications and effects of adaptive threshold voltage (Vth) controls, which help reduce leak current in logical circuits.
We will also introduce techniques for reducing the leak current in memory structures and analog circuits, which are increasing in importance as SoC (system on a chip) components.

Tech Tale

DLP — the People Who Inherited Light (Final): “This Is the First Time to See this Kind of ‘White’” . . . p. 147
Larry J. Hornbeck of Texas Instruments Incorporated devoted himself to the development of the Digital Micromirror Device (DMD). The device is successfully being employed in front projectors and U.S. television manufacturers are displaying more and more interest as time goes by.
Use in rear projection televisions as well is edging upwards. One manufacturer boldly took up the challenge of incorporating the device into industrial multi-display applications.

Interview

Nissan Motor’s Executive Vice President, Mitsuhiko Yamashita: “Electronic Technologies Will Enable New Flowers in All Sorts of Areas” . . . p. 152
Nissan Motor Co., Ltd. management underwent a major reshuffle in April 2005. The management team was markedly rejuvenated with, for example, the promotion of 51 year-old Toshiyuki Shiga to Chief Operating Officer (COO). 52 year-old Mitsuhiko Yamashita took charge of research and development as Executive Vice President. Having led the life of a mechanical engineer, he pins his hopes on electronics, saying: “Electronic technologies have the hidden potential to generate significant innovation.”

Spotlight:	22	For further information, please contact: Nikkei Electronics 2-1-1, Hirakawacho Chiyoda-ku, Tokyo 102-8622, Japan Vox: +81-3-5210-8141, Fax: +81-3-5210-8510 http://ne.nikkeibp.co.jp/
What's New:	27
Selected Shorts:	36
New Products:	43
Leading Trends:	49
Cover Story:	75
Guest Viewpoint:	95
NET's Seminar:	102
Tech Tale:	147
Interview:	152
Coming Next:	139
From the Readers:	140
From the Editors:	141
Calendar:	142