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Nikkei Microdevices

April 2006 Issue : TABLE OF CONTENTS

Cover Story

Flash memory breaks through the year 2009 problem

Special Feature

Samsung on the offensive for liquid crystal television with 7th-generation LCD plant

Inside LSI(DFM)

High-speed multi-function DFM technology fills in lithography's gap of weakness"

Report LSI

EUV lithography technology shows steady progress in development as alpha tool resolution is unveiled

Report LSI

Olympus cuts down digital camera SoC cost by 30 percent

Report FPD

Where commercialization of Toshiba's SED television is headed

Report FPD

Flip chip bonder developed to accelerate the move to smaller LEDs with higher efficiency

Report FPD

Low-power drive technology for LCD television aims at "40-inch, 100W"

Inside-EDA

Toshiba works toward realizing uniform quality in SoC design among their worldwide facilities

Inside MEMS

VTI grows with MEMS sensors

Report MEMS

MEMS sensor that can be used within the engine

Tutorial

Overview of process equipment technology analyzed through the front-runner (3): Lithography technology

High-resolution achieved with comprehensive technology from equipment to circuit layout

Emerging Technology

A total reversal in approach to create mask pattern realizes transfer characteristics that exceed OPC

Key Word

Next-generation transistor model

Keyperson

How Samsung charts its way to flash memory scaling

Keyperson

Funai Electric, an unorthodox Japanese manufacturer’s global strategy in flat panel television

Interview

"Vacuum technology enables cost reduction"

Kyuzo Nakamura, ULVAC President and CEO

Challenger

Achieving low cost in next-generation display without using MEMS