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Microdevices December 2004 Issue
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Nikkei Microdevices |
December 2004 Issue : TABLE OF CONTENTS
Emerging
Using carbon nanowalls for LED backlight
Key Word
"Inkjet"
Key Person
"We will challenge the LCD television market from the volume
zone"
Feature
Get hold of MEMS, the next front-runner of devices
Part 1: LSI, FPD, and the next will be MEMS
Part 2: Device development infrastructure implementation progresses
Special Feature
SEMICON Japan 2004: Equipment development advances with immersion lithography
and high-k
Inside LSI
Toshiba's new challenge comes into sight with its partnership with
Xilinx, U.S.A.
The latest trend in research to exceed the limits of flash memory
How verification is performed for ASICs with 10 million gates
Selete Part 3: Low-k film (1) - Disadvantages of the porous film are
overcome, making way for practical application at hp65
Inside FPD
Televisions are no longer the benchmark for image quality
Report
Elpida goes public, next aiming for world's top position in DRAM
Interim financial statements for fiscal 2004 manage to avoid serious
trouble even in a downward phase with front-loading
ASML challenges the market with immersion tools, plans to ship 0.93
NA tools in 2005
New plant operation system proposed by Applied Materials, U.S.A.
Tutorial
Series: EDA Overview - part 5: Mask design and DFM (design for manufacturability)
Interview
Agilent's strategy in entering the FPD test market
Challenger
Opening up a new realm with micro powder
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