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Nikkei Microdevices

February 2004 Issue : TABLE OF CONTENTS

Special Feature

Proposals for the complete revival of the Japanese semiconductor industry

Inside Logic

SOI plays a principal role in cutting-edge LSI technology, with bonded SOIs becoming the main stream

Inside FPD

Television demand triggers LCD panel parts and materials shortage

Report

Report/Logic
Worldwide EDA market is finally out of the worst, but still stagnant as of Q3 2003

Report/Logic
In November 2003, worldwide semiconductor market flourishes with 17.4% increase over the previous year

Report/Logic
Taiwan TSMC files a lawsuit against China SMIC

Report/Memory
RRAM material developer reports a new device property

Report/FPD
Report on 2004 International CES

Report/FPD
PC manufacturer enters FPD television market

Report/FPD
Non-contact glass substrate transfer technology aims for adoption in 7th-generation TFT plant

Watcher/Financial

SEMICON Japan 2003 shows lack of innovation in manufacturing process, indicating a need for active investment from major semiconductor companies

Watcher/International

Latest information on Taiwan

Emerging

Hardening wafers with "ice that does not melt in water"

Challenger

New concept displays hold the key to making "wearable products" popular

Key Person

Sharp's promising strategy to stake on liquid crystal TVs

Start Up

Challenging the world market with spherical solar cell technology

Interview

Investing 100 billion yen over 4 years for liquid crystal material: "We will go through with our investments even under the economic downturn"