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Nikkei Microdevices

January 2005 Issue : TABLE OF CONTENTS

Inside (FPD)

A look back at the past year of FPD: FPD image quality continues to advance; rapid improvement seen in black level and video characteristics

Inside (LSI)

Selete's challenge for innovation in new-generation materials, Part 4: Low-k film (2) - Prototype wiring that uses material with dielectric constant of 1.6, making full use of damage suppression technology

Inside (LSI)

High-speed SoC test equipment based on Japan's board technology

Report (LSI)

SEMICON Japan 2004 report: MEMS - a number of high integration technologies that cross the limits of miniaturization reported

Report (LSI)

SEMICON Japan 2004 report: LSI - 45nm equipment supporting introduction of SOI and low-k

Report (FPD)

IDW '04 report

Report (LSI)

System LSI Workshop - improving the efficiency of software development is the key to the development of SoC that can win in the global competition

Report (FPD)

Amorphous oxide semiconductor emerges as a candidate to be used in driver chips for "flexible displays"

Report (LSI)

"ORNAND," a new memory technology from Spansion, U.S.A.

Report (LSI)

STARC develops a technology that enables hardware/software co-verification 100 times faster

Emerging

Flexible sheet-like scanner is developed, which does not require optical and mechanical parts

Key Word

"High refractive-index fluid"

Key Person

Canon: "Our image devices will change the society in 2020"

Challenger

Offering high-value-added business with high-precision metal ball manufacturing

Interview

KLA-Tencor, U.S.A., furthers reduction in inspection costs