Home :. Table of Contents :. Index :. Nikkei Microdevices July 2006 Issue

Nikkei Microdevices

July 2006 Issue : TABLE OF CONTENTS

Cover Story

Organic EL starts operation, envisioning its future in mobile video equipment

Special Feature

Process technology of Seiko Epson Corp. reduces the manufacturing cost of flat panel displays by eliminating the need of photo lithography and chemical vapor deposition

Inside LSI

Advanced versions of SiP are appearing in succession, indicating “SiP is not just for stacked chips”

Inside EDA

Fujitsu’s SoC design technology erases the need of remaking ES

Inside MEMS

Results from analyzing the MEMS operation of Matsushita Electric Works, Ltd. reveal vertical expansion in automobiles, medical services, and batteries

Report FPD

Flash report from “SID 2006”

Report LSI(MIRAI)

With an aim to address reformed production, new MIRAIs reduce variations and the number of wiring layers

Report LSI

Slight roughness of Si wafer’s surface can be detected with high speeds

Report MEMS

Complex sensors (integrating multiple types) are mushrooming in the market

Report EDA

TeraRecon, Inc. launches vector processor chips for image processing of medical equipment

Tutorial

Overview of process equipment technology analyzed through the front runner (6): Doping process
Ion implantation and anneal determine the performance of transistors

Emerging Technology

Manufacturing organic EL elements at low cost by using DNA

Key Word

Software Simulator

Keyperson

Toshiba’s semiconductor business strategy aims to win a share of 40% in the market of NAND flash memory

Keyperson

“How will you treat SED and organic EL?” - Interview with Canon’s new president

Interview

Organic EL equipment strategy of Tokki Corp. - “We intend to defeat LC with cost strategy”