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Nikkei Microdevices

March 2005 Issue : TABLE OF CONTENTS

Inside LSI (NEC)

EDA tool that can quickly estimate LSI package cost

Report LSI

Popularity in structured ASIC revives interest in master slice technology

Emerging Tech/Transparent flexible substrate

Bacteria to create flexible substrates

Report (LSI)/Atomic switch

Atomic switches to go beyond the limitations of miniaturization in silicon devices

Interview/JSR

Material to redraw the roadmap for lithography technology

Challenger/MEMSAS

Inserting MEMS into the body to perform "pinpoint operation" without the use of scalpels

Special Article

A revolution in computing, "CELL" makes its debut

Inside FPD

Larger substrates alone cannot reduce LCD costs

Key Word

Full HD

Report (FPD)

Can PDP survive in the FPD competition?

Special Feature

MEMS will open new ways for cell phones in 2010

Key Person

PDP is the leading player in large-screen televisions, and will not surrender this position

Inside (Selete)

Selete's challenge for innovation in new-generation materials, Part 5: Low-k film (3) - Exercising plasma technology to prevent porous low-k film damage

Report (ISSCC)

Various multicore technologies appear to overcome the power consumption crisis