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Nikkei Microdevices

March 2006 Issue : TABLE OF CONTENTS

Cover Story

The day when solar cells will not use polysilicon anymore

Emerging Technology

SOI technology expands the use of RFID tags

Challenger

CEO of Silvaco/Simucad (U.S.) "will capture the market from Cadence and grow"

Keyword

EES

Keyperson(Mr. Taguchi from Spansion)

Spansion talks about the future of nonvolatile memory

Keyperson(Kyodo Fab)

"Will aim for the establishment of a Japanese independent foundry"

Inside FPD

The digital broadcasting age meets a new standard that allows more natural colors, breaking free from the constraints of NTSC

Inside EDA

Renesas now developing an EDA system that cuts SoC design time by 60 percent

Inside MEMS

Analyzing MEMS companies that are rapidly growing with their sensors

Inside(Nano CMOS)

A stream of new materials targeting CMOS devices appear

Report

A group from Keio University establishes technology that enables highly productive mass-production of high-performance optical film

Report(MEMS2006)

Process technology that lowers the cost of RF MEMS device

Report(45nm of Intel)

Intel develops prototype of 45nm SRAM

Report(Spansion)

Non-floating gate flash memory products successively debut on the market

Report

Fujitsu's semiconductor strategy focusing on logic LSI gets on track

SoC Story

SIMD processor with 352 parallel processor elements for Ricoh's copier

Tutorial

Overview of process equipment technology analyzed through the front-runner (2): CMOS device

The combination of process modules produces a variety of devices

Interview(Dai Nippon Printing)

Dai Nippon Printing talks about development of exposure mask for the 32nm node