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Nikkei Microdevices

May 2004 Issue : TABLE OF CONTENTS

Inside Logic

Inside Logic
Equipment manufacturers start practical application of the ALD technology

Inside Logic
Intel reveals the full picture of strained Si technology

Inside Logic
EDA system built for SystemC-based co-design/co-verification of SoC

Inside Logic
Latest technology to increase the efficiency of SoC verification: Transaction

Inside Logic
Fujitsu proposes an LSI that is flexible to user requirements

Inside Memory

New plasma technology overcomes fundamental challenges in process technology

Report

Report/FPD
The significance of Seiko Epson and Sanyo Electric merging small and mid-sized LCD operations

Report/Logic
Film forming technology that performs copper plating and CMP processes in one process

Report/Logic
"The Human ECO Compiler" gathers excitement at the Synopsys User Conference

Report/Logic
Software developed to estimate packaging costs at once

Report/FPD
EDEX 2004 report: Epson presented a 12.5" organic EL display and TMD (Toshiba Matsushita Display) showed OCB mode LCD panels for mass-production

Report/FPD
Development of organic transistor with attention on flexibility becoming active

Emerging Technology

One trillion bits per square inch memory realized in probe recording performed on ferroelectric material

Key Person

Investing 160 billion yen to put one's stake in cutting-edge Si foundry

Key Person

New company for organic EL to be launched two years from now

Start Up

Si foundry utilized to differentiate liquid crystal driver LSIs

Interview

Experience in device technology is leveraged to challenge the market with an evaluation and analysis solution

Watcher/International

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