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Nikkei Microdevices

May 2005 Issue : TABLE OF CONTENTS

Special Feature

Yield improvement by DFM changes engineers' way of working

Keyword

Nanoimprint

Emerging Technology

Polishing technology that realizes 5 nm thick silicon substrates

Key Person

Leveraging strength in automobile applications to expand out to the consumer products market

Interview

Seeking the ultimate immersion lithography that uses pure water

Inside FPD

The technological strength of three LCD companies joining forces achieves great strides in overcoming weak points

Inside LSI

Letter to "Tsukuba" - R&D directly connected to business in Albany, U.S.

Inside LSI

The roadmap for strained silicon changes in the 65nm to 45nm range

Inside NT

Using polymers to manufacture MEMS devices with lower cost

Tutorial

Improving efficiency of functional verification is the key to shorter SoC development time

Report

Channel material changed to Ge to reduce gate insulator thickness

Report

A series of new ideas on sensors for cell phones

Report

MEMS devices for cell phones start with replacing crystal oscillators

Report

Future business for manufacturing equipment makers