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Nikkei Microdevices

November 2005 Issue : TABLE OF CONTENTS

SANYO Electric Co., Ltd. recovers from an earthquake

Special Feature

Wafer thickness reduced to the range of 30 to 2 μm

LSI manufacturers compete with each other to gain superiority in the Si through-hole technology

Inside LSI

Cortex-A8, a new-generation ARM core, marks 1 GHz operation at 65nm

Predicting where the semiconductor joint Fab is going

Sony's SoC "HD Codec Engine" for HD digital video

DRAMs break through their limitations with capacitor-less structure

"ISSM 2005" report
Cooperation of APC and DFM is the key

Report LSI

Samsung secures reliability and yield with its proprietary circuit simulator

Repot LSI

"Competition for dominance gets fiercer in oxide film etching equipment - Conventional plasma etching is winning"

"2005 IEDM" preview
New combinations of processes appear in succession

Inside FPD

Flash report from "FPD International 2005"

FPD

Quantitative assessment of image quality of "Sony panels"

Inside MEMS

Analyzing the winner group of MEMS companies

Emerging

Laying out nano-size wire inside Si crystal

Key Word

PRAM

Key Person

Strategy of Matsushita Electric Industrial Co., Ltd. - It takes the offensive across the world with promo phrase of "Thin, Digital, and HD"

Key Person

"The ideal state of Japanese semiconductor industry" that the Ministry of Economy, Trade and Industry expects to see

Focusing on creating a flexible organization good at dealing with environmental changes