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Nikkei Microdevices

November 2006 Issue : TABLE OF CONTENTS

Cover Story

The battle against imitation - how to prevent technology outflow

Special Feature

Flash report from "FPD International 2006"

Inside LSI

Understanding what really lies below the disturbing signs in the semiconductor industry

Report LSI (ReRAM)

IBM Corp. and Sharp Corp. unveil their new achievements in ReRAM development

Report LSI

Spansion Inc. brings 4-bit-per cell flash memory to market

Report LSI

Immersion lithography ready for mass-production; expectations rise for materials with high refractive index targeting 32nm

Inside EDA

Fujitsu to commercially provide two statistical static timing analyzers

Report

STARC developing a new design flow with focus on DFM

Report

TSMC unveils their development roadmap

Report MEMS

CEATEC flash report: A host of MEMS devices make their debut

Tutorial

Overview of process equipment technology (9): SOI technology

Emerging Technology

Intel develops technology to integrate multiple lasers on a silicon substrate

Keyword

CTF (Charge Trap Flash)

Key Person

SED's challenge to offer a new video environment

Key Person

Matsushita's PDP strategy does not shy away from cost

Interview

The new business strategy of Applied Materials, Inc.

New Products

Wafer cleaning equipment/Dainippon Screen Mfg. Co., Ltd.
Sputter system/etching tool for PZT/ULVAC,Inc.
Inspection system for printed circuit boards/Yamaha Motor Co., Ltd.
4chanel functional generator/Tabor Electronics Ltd.
Transferring System for Large Size Glass Substrate / Hirata Corp.
colorimeter for MPRT measurement / DELTA