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Nikkei Microdevices

October 2004 Issue : TABLE OF CONTENTS

Cover Story

The Truth about SiP

Inside LSI

Part 2: High-k (2)
Challenges overcome to make way for practical application at 65nm: Controlling “Fermi level pinning”

Tutorial

Series: EDA Overview-Mask design, part 4

Report

Report/LSI
Matsushita Electric Industrial announces a new SoC platform for consumer electronic products

Report/LSI
Silicon dot flash memory nearing practical application

Report/LSI
Foreign substance inspection technology for SOI wafers

Report/LSI
Metal gates that will accelerate the widespread use of high-k takes off on a full scale

Report/LSI
TSMC of Taiwan announces a reference flow that takes packaging and power consumption into consideration

Report/LSI
SSDM 2004 preview

Report/LSI
MeP (Media embedded Processor) to be incorporated into cell phones

Inside Display

"The first plant start-up is successful": TFT-LCD panel strategy in China

Report/FPD

Report/FPD
Both Samsung and Fujitsu develop a new technology that further improves the high image quality of VA LCDs

Report/FPD
Sony first to adopt LED backlight for televisions

Report/FPD
Hitachi, Matsushita, and Toshiba officially announce joint venture in LCD manufacturing

Inside New Technology

MEMS Solution 2004: Part 2
Simplifying the RF circuit of cell phones; low-cost sensor also to be realized

Emerging technology

Organic switching device with new structure

Key Word

Silicon dot memory

Key Person

B. J. Lin, TSMC of Taiwan: "We will feature immersion lithography for our third-generation technology"

Key Person

Epson and Sanyo's strategy to merge their LCD businesses to win small and medium-sized LCD panel market competition

Interview

Walden C. Rhines, CEO, Mentor Graphics, U.S.A.
" We will focus on a solution that can make this company the best"

Challenger

Human device will be the next new semiconductor application

New Product

High-speed microscope/Olympus and Shimadzu Corporation

Particle size analyzer/Horiba

Oscilloscope/Tektronix, U.S.A.

LCD driver IC/Tomato LSI

DSP processor core/ARC International, U.S.A