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Nikkei Microdevices

September 2005 Issue : TABLE OF CONTENTS

<Features in the regular issue>

Car device business takes off

Area control

Small- to mid-size LCD panel strategy with competitive cost

Samsung adopts maskless and non-sputtering technology, working towards becoming the leader in production technology innovation

Facing the largest-ever process challenge, the thinning limit of gate insulating films is overcome

IBM's 65nm ASIC brings innovation in EDA with technology to address variation

LCD for mobile phones with limited viewing angle - a simple mechanism that prevents others from taking a peek at the display

Sony to implement specialized MEMS production line for gyro-sensor production

Texas Instruments changes its package strategy to focus its operation in Japan to development

Competition heats up in ArF immersion lithography, the issue for process is defects caused by materials

Comprehensive look from high-k gate stack to quantum computer component technology

The age of DFM has arrived - what Japan should do in terms of intellectual property rights

<Features in the standalone supplement>

The next growth engine in device industry

Part 4: Application technology

World semiconductor industry eyes one trillion U.S. dollars by 2020

China and India experiencing rapid growth, but what should U.S. and Japan do?

Humanoid robots to drive Si devices in the 2010s

DNA chips for research to medical uses, and further on for the six billion population

"Semiconductor is not yet a mature industry" - three challenges to overcome for further progress

Theme for the 21st century is "network and environment" - mobilizing all technologies from semiconductors to nanotechnology

High-quality Si thin film produced using biotechnology

Ion implantation equipment using gas cluster ion beam technology

On-site service reduces test cost

Mounting optical switch on silicon substrate to realize optical communication technology